Schobertechnologies to demo RSM IML MX 410 at LOUPE Americas

Schobertechnologies will showcase its latest converting technologies at LOUPE Americas 2026, September 15-17 in Chicago, with a live demonstration of its RSM IML MX 410 system in booth 6623.

The RSM IML MX 410 is designed for high-efficiency diecutting and automated stacking of in-mold labels (IML). At the show, the system will be equipped with Schobertechnologies’ Single Spider Plus technology for automated stacking following the diecutting process.

The modular RSM IML platform can also be configured with additional options based on individual production requirements.

In addition to its IML technology, Schobertechnologies will highlight a range of rotary diecutting and punching solutions for narrow web and packaging applications. These include rotary diecutting and perforating technology for processing blister packaging made from materials including PVC and PET.

The company will also feature high-capacity rotary diecutting technology for web widths up to 1,000 mm and cylinder repeats up to 40″, as well as high-performance punching modules designed to process paper, film and foils as thin as 0.015 mm.

Schobertechnologies’ portfolio also includes built-in and drop-in punching modules with line-hole punching tools and punch-waste removal technology designed for integration into narrow web printing presses.

LOUPE Americas visitors will be able to see the RSM IML MX 410 in operation and discuss configurations for IML and other converting applications with the Schobertechnologies team.